BS EN 61190-1-3-2002 电子组件用的连接材料.电子焊接设备用的电子分级焊料合金和助熔剂和非助熔剂的要求

作者:标准资料网 时间:2024-05-15 01:12:31  浏览:8388   来源:标准资料网

【英文标准名称】:Attachmentmaterialsforelectronicassembly-Requirementsforelectronicgradesolderalloysandfluxedandnon-fluxedsolidsoldersforelectronicsolderingapplications
【原文标准名称】:电子组件用的连接材料.电子焊接设备用的电子分级焊料合金和助熔剂和非助熔剂的要求
【标准号】:BSEN61190-1-3-2002
【标准状态】:作废
【国别】:英国
【发布日期】:2002-08-12
【实施或试行日期】:2002-08-12
【发布单位】:英国标准学会(GB-BSI)
【起草单位】:BSI
【标准类型】:()
【标准水平】:()
【中文主题词】:名称与符号;焊锡;钎焊;质量;合金;合格;焊料合金;质量保证;助熔剂(材料);使用;分类;组分;试验;规范(验收);定义;检验;电子工程
【英文主题词】:Alloys;Applications;Classification;Composition;Definition;Definitions;Designations;Electronicengineering;Fluxes(materials);Inspection;Qualifications;Quality;Qualityassurance;Solderalloys;Solderings;Solders;Specification(approval);Testing;Use
【摘要】:ThispartofIEC61190prescribestherequirementsandtestmethodsforelectronicgradesolderalloys,forfluxedandnon-fluxedbar,ribbon,andpowdersolders,otherthansolderpaste,forelectronicsolderingapplicationsaswellasforspecialelectronicgradesolders.Forthegenericspecificationsofsolderalloysandfluxes,seeISO9453,ISO9454-1andISO9454-2,respectively.ThisstandardisaqualitycontroldocumentandisnotintendedtorelatedirectlytothematerialperformanceinthemanufacturingprocessSpecialelectronicgradesoldersincludeallsolderswhichdonotfullycomplywiththerequirementsofstandardsolderalloysandsoldermaterialslistedherein.Someexamplesofspecialsoldersareanodes,ingots,preforms,barswithhookandeyeends,multiple-alloysolderpowders,etc.
【中国标准分类号】:L10;J33
【国际标准分类号】:25_160_50;31_190
【页数】:38P.;A4
【正文语种】:英语